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Plating PTFE (Teflon®)Polyflon has developed a proprietary plating process for electroplating directly onto PTFE. This unique process ensures a powerful molecular bond between the PTFE dielectric and conductive metal layer. Electroplated PTFE withstands continuous temperatures of 175°C and 225°C short term without damage to the plated material, dielectric, or the bond between them. Electroplated PTFE also performs well at low temperatures, even under cryogenic conditions The combination of pure PTFE and Polyflon's proprietary plating process produces materials that handle a wide range of applications from antennas and radomes to capacitors and surface/volume coils for NMR/MRI systems (See Photo). General PlatingPolyflon's plating capabilities have been expanded and refined over the past quarter century and includes metals such as OFHC (oxygen free hard copper), nickel, silver, hard and soft gold and tin/lead. The in-house plating capabilities allows Polyflon to copper-plate directly to the surface of various dielectric materials, plate up materials that have been metalized by other substrate manufacturers, or plate through holes on PTFE based products. Copper plating thickness typically range from 1/8 ounce/ft·sq. (0.175 mils) to 16 ounces/ft·sq. (22.4 mils) with a typical minimum of 1 ounce/ft·sq. (1.4 mils) for plated through holes. Plating
metals and associated thickness satisfy mil spec requirements
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