Plating
Plating PTFE (Teflon®)
Polyflon has developed a proprietary plating process for electroplating directly onto PTFE. This unique process ensures a powerful molecular bond between the PTFE dielectric and conductive metal layer. Electroplated PTFE withstands continuous temperatures of 175°C and 225°C short term without damage to the plated material, dielectric, or the bond between them. Electroplated PTFE also performs well at low temperatures, even under cryogenic conditions
The combination of pure PTFE and Polyflon's proprietary plating process produces materials that handle a wide range of applications from antennas and radomes to capacitors and surface/volume coils for NMR/MRI systems(See Photo).
General Plating
Polyflon's plating capabilities have been expanded and refined over the past quarter century and includes metals such as OFHC (oxygen free hard copper), nickel, silver, hard and soft gold and tin/lead.
The in-house plating capabilities allows Polyflon to copper-plate directly to the surface of various flurocarbon dielectric materials and most RF/Microwave circuit board materials. Copper plating thickness typically range from 1/8 ounce/ft·sq. (0.175 mils) to 16 ounces/ft·sq. (22.4 mils) with a typical minimum of 1 ounce/ft·sq. (1.4 mils) for plated through holes.
