Polyflon’s proprietary process for electroplating directly onto PTFE ensures a powerful molecular bond between the dielectric and conductive metal layer.
Electroplated PTFE withstands continuous, short-term temperatures up to 225° C without damage to the plated material, dielectric, or the bond between them. Electroplated PTFE also performs well at low temperatures, even under cryogenic conditions. The combination of pure PTFE and Polyflon’s proprietary plating process produces materials well suited for applications such as printed circuit boards, antennas, radomes, capacitors, and surface/volume coils for NMR/MRI systems.
Polyflon has expanded its electroplating offering over the last 25 years to include dielectric materials such as:
- Paper-Based Phenolic
- Polyethylenimine (PEI)
- Polychlorotrifluoroethene (PCTFE)
- Polyether ether ketone (PEEK)
Polyflon offers plating of various metals including oxygen-free hard copper (OFHC), nickel, silver, hard and soft gold, and immersion /electrolytic tin. Copper plating thickness ranges from 1/8 oz./ft2 (0.175 mil) to 16 oz./ft2 (22.4 mil) with a typical minimum of 1 oz./ft2 (1.4 mil) for plated-through holes.